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siow k die attach materials high temperature app 2019

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Textbook in PDF format Technology development in microelectronics continues at a historically unprecedented pace. Given the complexity of development and manufacturing—from the many different components and functionalities comprising any single system, to the range of processing methods and materials, through to competing application requirements like reliability, temperature resistance, miniaturization, and cost-efficiency—this may seem astounding. However, perhaps it is exactly this need to approach development of any one component, process or material with a view to its compatibility with the system as a whole, that accelerates development across the board of research specialties in this area. This book focuses on a key demand in microelectronics application areas—along with miniaturization and robustness, high temperature is a key demand driving development. Industries relying on high-temperature microelectronics are economically key and include automotives (e-mobility, power electronics in hybrid, and electrical cars), sensors systems, and the lighting industry (LED packaging). Extreme demands, operating temperatures of 150 C, are placed on electronic components and the interconnections in these areas, and in order to do justice to the harsh operating conditions, new packaging materials are needed that are above all corrosion and temperature resistant, as well as suitable, cost-efficient manufacturing processes

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Siow K. Die-Attach Materials for High Temperature App...2019.pdf 12.3 MB

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siow k die attach materials high temperature app 2019