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lau j flip chip hybrid bonding fan fan out technology 2024

Type:: E-books
Files:: 2
Size:: 32.1 MB
Uploaded On:: July 14, 2024, 6:08 a.m.
Added By:: andryold1
Seeders:: 1
Leechers:: 0
Info Hash:: 12E72655D6A81ADD611170F0A1790C1DD772FEC9

Textbook in PDF format This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as wafer bumping, flip chip assembly, underfill and reliability, chip-to-wafer, wafer-to-wafer, Cu-Cu hybrid bonding, WLCSP, 6-side molded WLCSP, FOWLP such as hybrid substrates with PID, ABF, and ultra-large organic interposer, the communications between chiplets and heterogeneous integration packaging, and on-board optics, near-package optics, and co-packaged optics. The book benefits researchers, engineers, and graduate students in the fields of electrical engineering, mechanical engineering, materials sciences, industry engineering, etc

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Lau J. Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology 2024.pdf 32.0 MB

Details for: Lau J. Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology 2024

lau j flip chip hybrid bonding fan fan out technology 2024

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