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du x thermal reliability power semiconductor device 2022

Type:: E-books
Files:: 1
Size:: 7.8 MB
Uploaded On:: July 11, 2022, 9:15 a.m.
Added By:: andryold1
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Info Hash:: 3641714CBFE1FA5142D90082F8284D585EE00FE6

Textbook in PDF format This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device. Introduction Thermal Fatigue Failure Mechanism of IGBT Module Thermal Model and Thermal Parameter Monitoring Junction Temperature Extraction of the Power Semiconductor Device Multi-time Scale Lifetime Evaluation of the Device in the Renewable Energy System Thermal Management Method and Optimization Prospect

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Du X. Thermal Reliability of Power Semiconductor Device...2022.pdf 7.8 MB

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du x thermal reliability power semiconductor device 2022

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