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Details for:
Zhang H. Modeling, Analysis, Design,...Electronics...2020
zhang h modeling analysis design electronics 2020
Type:
E-books
Files:
1
Size:
25.2 MB
Uploaded On:
Nov. 29, 2019, 7:42 a.m.
Added By:
andryold1
Seeders:
0
Leechers:
0
Info Hash:
11F5B9498CC04E89011100764C07EF47520A5357
Get This Torrent
Textbook in PDF format This book provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included
Get This Torrent
Zhang H. Modeling, Analysis, Design, and Tests for Electronics Packaging...2020.pdf
25.2 MB
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