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tong h lai y wong c eds advanced flip chip packaging 2013

Type:: E-books
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Textbook in PDF format Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable. Market Trends: Past, Present, and Future Technology Trends: Past, Present, and Future Bumping Technologies Flip-Chip Interconnections: Past, Present, and Future Flip Chip Underfill: Materials, Process, and Reliability Conductive Adhesives for Flip-Chip Applications Substrate Technology IC-Package-System Integration Design Thermal Management of Flip Chip Packages Thermo-mechanical Reliability in Flip-Chip Packages Interfacial Reactions and Electromigration in Flip-Chip Solder Joints

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Tong H., Lai Y., Wong C. (Eds.) Advanced Flip Chip Packaging 2013.pdf 26.2 MB

Details for: Tong H., Lai Y., Wong C.(Eds.) Advanced Flip Chip Packaging 2013

tong h lai y wong c eds advanced flip chip packaging 2013