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li y 3d microelectronic packaging from architect app 2ed 2021

Type:: E-books
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Size:: 35.4 MB
Uploaded On:: Jan. 24, 2021, 8:40 a.m.
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Textbook in PDF format This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. Introduction to 3D Microelectronic Packaging 3D Packaging Architectures and Assembly Process Design Materials and Processing of TSV Microstructure and Mechanical Reliability Issues of TSV Phase-Field-Crystal Model: A Tool for Probing Atoms in TSV Atomic Scale Kinetics of TSV Protrusion Fundamentals and Failures in Die Preparation for 3D Packaging Direct Cu to Cu Bonding and Alternative Bonding Techniques in 3D Packaging Copper Micro and Nano Particles Mixture for 3D Interconnection Application Fundamentals of Bonding Technology and Process Materials for 2.5/3D Packages Fundamentals of Solder Alloys in 3D Packaging Fundamentals of Electromigration in Interconnects of 3D Packaging Fundamentals of Heat Dissipation in 3D IC Packaging and Thermal-Aware Design Fundamentals of Advanced Materials and Processes in Organic Substrate Technology Die and Package Level Thermal and Thermal/Moisture Stresses in 3-D Packaging: Modeling and Characterization Processing and Reliability of Solder Interconnections in Stacked Packaging Interconnect Quality and Reliability of 3D Packaging Fault Isolation and Failure Analysis of 3D Packaging

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Li Y. 3D Microelectronic Packaging. From Architectures to App. 2ed 2021.pdf 35.4 MB

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li y 3d microelectronic packaging from architect app 2ed 2021

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